Bond Strength of Current Adhesives with Different Components on Dentin

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Ersoysal M., Akbaba M., Çetin Tuncer N., Barutçugil Ç.

Necmettin Erbakan University 3. International Dentistry Congress, Konya, Türkiye, 24 - 26 Mayıs 2024, ss.356

  • Yayın Türü: Bildiri / Özet Bildiri
  • Basıldığı Şehir: Konya
  • Basıldığı Ülke: Türkiye
  • Sayfa Sayıları: ss.356
  • Akdeniz Üniversitesi Adresli: Evet

Özet

Objectives: The aim of this in vitro study was to compare the bond strength of solvent-containing and solvent-free bonds to dentin

using the microtensile bond strength (μTBS) test.

Materials and Methods: Eight extracted caries-free human molars were used in the study. After the occlusal enamel was removed

using a low-speed diamond saw and precision cutting device under water cooling, the dentin surfaces were sanded with 600 grit SiC

sandpaper under water cooling without adhesive application and the specimens were randomly divided into 4 groups. G1= Bond1-SF

(Pentron) / SE mode, G2= Bond1-SF (Pentron) / EAR mode, G3= Prime Bond (Dentsply) / SE mode) and G4= Prime Bond (Dentsply)

/ EAR mode). After the adhesives were applied to the groups, a 4x4x4 resin-based microhybrid composite was applied to the relevant

surface. Rods with a thickness of 1 mm (± 0.2 mm) were obtained from the specimens using a low-speed diamond saw and precision

cutting device under water cooling (n=10). These bars were subjected to tension at a head speed of 1 mm/min in a universal testing

machine for microtensile bond strength (μTBS) testing and measurements were recorded. The modes of fracture were determined

under a stereomicroscope (Adhesive/Mix/Cohesive). Data were analyzed by one-way ANOVA and Tukey HSD post hoc test (p<0.05).

Results: According to the data obtained, G2 (6.24±2.58 MPa) showed the lowest microtensile bond strength value, while G3

(16.11±7.43 MPa) and G4 (16.69±7.6 MPa) showed the highest value, but there was no significant difference between them. The

most common fracture type was adhesive type fractures in all groups.

Conclusions: In line with the findings of the present study, it was shown that the bonding success was better when using a solvent-

containing universal adhesive (Prime Bond-Dentsply) in both SE and EAR mode on the dentin surface, while EAR mode should be

preferred if a solvent-free adhesive (Bond1-SF -Pentron) is to be used.

Keywords: Solvent, microtensile bond strength, self etch, etch and rinse