Evaluation of Bond Strength of Different Adhesive Systems on Enamel


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Akbaba M., Ersoysal M., Çetin Tuncer N., Barutçugil Ç.

Necmettin Erbakan University 3. International Dentistry Congress, Konya, Türkiye, 24 - 26 Mayıs 2024, ss.391

  • Yayın Türü: Bildiri / Özet Bildiri
  • Basıldığı Şehir: Konya
  • Basıldığı Ülke: Türkiye
  • Sayfa Sayıları: ss.391
  • Akdeniz Üniversitesi Adresli: Evet

Özet

Objective: The aim of this in vitro study was to compare the microtensile bond strengths to enamel with the application of solvent-

containing and solvent-free bonds in EAR and SE modes.

Materials and Methods: Twelve extracted caries-free human molars were used in the study. The enamel surfaces of the teeth were

randomly divided into 4 groups after polishing with 600 grit SiC sandpaper under water cooling. G1= Bond1-SF (Pentron) / SE mode,

G2= Bond1-SF (Pentron) / EAR mode, G3= Prime Bond (Dentsply) / SE mode) and G4= Prime Bond (Dentsply) / EAR mode). After

the adhesives were applied to the groups, a 4x4x2 resin-based microhybrid composite was applied to the relevant surface. Rods with

a thickness of 1 mm (± 0.2 mm) were obtained from the specimens using a low speed diamond saw and precision cutting device under

water cooling (n=10). These bars were subjected to tension at a head speed of 1 mm/min in a universal testing machine for microtensile

bond strength (μTBS) testing and measurements were recorded. The modes of fracture were determined under a stereomicroscope

(Adhesive/Mix/Cohesive). Data were analyzed by one-way ANOVA and Tukey HSD post hoc test (p<0.05).04r

Results: According to the data obtained; G1 (6.84±3.65 MPa) showed the lowest microtension bond strength, while there was no

significant difference between it and G3 (8.89±2.79 MPa). G4 (21.24±9.96 MPa) showed the highest microtensile bond strength while

there was no significant difference with G2 (19.69±5.18 MPa). The most common fracture type was adhesive fractures in all groups,

followed by mix fractures.

Conclusions: Based on the findings of the present study, it can be concluded that the EAR mode with phosphoric acid etching is a

better option for improving the bonding success of adhesives to the enamel surface.

Keywords: Microtensile bond strength, Adhesive, Self-etch, Etch and rinse