S. HELHEL, "How N2 Flow Rate Changes Etching," IEEE ICOPS 2006 , vol.1, no.1, United States Of America, pp.326, 2006
HELHEL, S. 2006. How N2 Flow Rate Changes Etching. IEEE ICOPS 2006 , (United States Of America), 326.
HELHEL, S., (2006). How N2 Flow Rate Changes Etching . IEEE ICOPS 2006 (pp.326). , United States Of America
HELHEL, SELÇUK. "How N2 Flow Rate Changes Etching," IEEE ICOPS 2006, United States Of America, 2006
HELHEL, SELÇUK. "How N2 Flow Rate Changes Etching." IEEE ICOPS 2006 , United States Of America, pp.326, 2006
HELHEL, S. (2006) . "How N2 Flow Rate Changes Etching." IEEE ICOPS 2006 , United States Of America, p.326.
@conferencepaper{conferencepaper, author={SELÇUK HELHEL}, title={How N2 Flow Rate Changes Etching}, congress name={IEEE ICOPS 2006}, city={}, country={United States Of America}, year={2006}, pages={326} }