HELHEL, S. 2006. How N2 Flow Rate Changes Etching. ICOPS 2006, IEEE International Conferance on Plasma Science , (United States Of America), 322.

HELHEL, S., (2006). How N2 Flow Rate Changes Etching . ICOPS 2006, IEEE International Conferance on Plasma Science (pp.322). , United States Of America

HELHEL, SELÇUK. "How N2 Flow Rate Changes Etching," ICOPS 2006, IEEE International Conferance on Plasma Science, United States Of America, 2006

HELHEL, SELÇUK. "How N2 Flow Rate Changes Etching." ICOPS 2006, IEEE International Conferance on Plasma Science , United States Of America, pp.322, 2006

HELHEL, S. (2006) . "How N2 Flow Rate Changes Etching." ICOPS 2006, IEEE International Conferance on Plasma Science , United States Of America, p.322.

@conferencepaper{conferencepaper, author={SELÇUK HELHEL}, title={How N2 Flow Rate Changes Etching}, congress name={ICOPS 2006, IEEE International Conferance on Plasma Science}, city={}, country={United States Of America}, year={2006}, pages={322} }